Besi and Imec Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

| Redakteur: Johann Wiesböck

The nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing.

Firmen zum Thema

The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
(Image source: Urs Wyss)

3D IC technology, stacking multiple dies into a single device, aims to increase the functionality and performance of next-generation integrated circuits while reducing footprint and power consumption. It is a key technology to enable the next generation of portable electronics, such as smartphones and tablets, which require smaller ICs that consume less power.

High-Accuracy die-to-die and die-to-wafer bonding

One of the key challenges to making 3D IC manufacturing a reality is the development of high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Flip chip and reflow soldering, which are currently combined for bonding, require lenient bonding accuracy on large bump pitches (around 150-50 µm bump pitch). Bump pitches need to further scale down to 40-10 µm to realize a sufficiently high performance.

This needs high accuracy in bonding within the range of 1-2um @3sigma. Moreover, an automatic process flow is essential for industrial adoption. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, although with this comes long cycle times due to temperature and pressure profiles and processing methods which hinder industrial adoption of this technology up to now.

Imec and Besi will conduct joint research to develop a high-throughput thermocompression bonder in an automated process flow, with high accuracy and shorter cycle times, paving the way to enabling a manufacturable 3D, 2.5D and 2.5D/3D hybrid technology.

“We are excited to work with a key research center such as imec and leverage its expertise in fine pitch bonding materials and processes to increase the yield and reliability of our equipment ,” said Richard Blickman, CEO at Besi. “This collaboration will enable us to benchmark our Chameo tool to meet the industrial needs of the semiconductor industry, offering our customers a viable and effective solution for 2.5D/3D IC manufacturing.”

About imec

Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan.

Its staff of over 2,080 people includes more than 670 industrial residents and guest researchers. In 2012, imec's revenue (P&L) totaled 320 million euro. Further information on imec can be found at Stay up to date about what’s happening at imec with the monthly imec magazine, available for tablets and smartphones (as an app for iOS and Android), or via the website

About Besi

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy.

Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit