English Articles

Multi-core is more than just multi-core

Debugger

Multi-core is more than just multi-core

When using MCU multi-core architectures for "deeply embedded" applications, different rules apply for symmetric multiprocessing on identical cores with support of an encapsulating OS. This poses an entirely new set of challenges for chip suppliers, tool manufacturers and users. lesen...

Future Motion Applications requiringsmart and compact Motion Control

Advanced Motion Controller

Future Motion Applications requiringsmart and compact Motion Control

An efficient power management is a must for today´s engineers due to the recent ErP rules of the European Union. While the changeover from AC to BLDC and PMSM Drives will improve system efficiency significantly, the advanced motion controller will further save energy. lesen...

Low-Power Motor Drive Design for Fridge Compressors

Compressors

Low-Power Motor Drive Design for Fridge Compressors

Dedicated, customisable motor control ICs and single-chip drivers can help appliance designers meet new, tougher ecodesign legislation as the ErP rules of the European Union. lesen...

Gigabit Network for the Car of the Future

Network

Gigabit Network for the Car of the Future

When the first digital display links with Gigabit data rates found their way into cars a few years ago, it looked like the bandwidth issue could be taken off the table for a while. Far from it! lesen...

Digital Isolators Provide a Reliable Alternative to Optocouplers

Galvanic Isolators

Digital Isolators Provide a Reliable Alternative to Optocouplers

Digital isolators have made an already complicated puzzle of safety standards even more confusing because not all standards address the requirements for digital isolators. lesen...

Autonomous or electrical – a matter of preference?

Editorial

Autonomous or electrical – a matter of preference?

A vast upheaval is in store for the automotive industry. lesen...

Texas Instruments' DSP Timeline of Important Events

History

Texas Instruments' DSP Timeline of Important Events

As one of the world's major semiconductor manufacturers, Texas Instruments offers digital and analog devices. 30 years ago, the company introduced its first digital signal processor. lesen...

New software helps estimating the design cost of PCBs

PCB Design

New software helps estimating the design cost of PCBs

The printed circuit board cost is a major factor in the price of electronic boards. And during the last 2 years there has been an increase of the average cost, ... lesen...

Designing advanced DSP applications on the Kinetis Cortex-M4 MCU

Case Study – Motor Control Application

Designing advanced DSP applications on the Kinetis Cortex-M4 MCU

In this case study we will look closer at a motor control application, where the use of the Kinetis MCU is suitable. lesen...

An Alternative Cost-Effective Design Flow for Mixed-Signal ASICs

EDA-Tools

An Alternative Cost-Effective Design Flow for Mixed-Signal ASICs

There is a well-entrenched and long-held view in the industry that for ASIC design, in the digital, analogue or mixed-signal domain, the only tools that will to deliver a workable solution are those from the major EDA tool companies. The assumption is that low-cost IC design tools will not deliver the required functionality or have the necessary process design kit (PDK) support for the target foundries. lesen...

Cheap Solar Energy from the Printing Press

Photovoltaics

Cheap Solar Energy from the Printing Press

Researchers of the Institute for Print and Media Technology at Chemnitz University of Technology [pmTUC] presented solar modules printed on standard paper using printing inks with electrical properties lesen...

Imec demonstrates extremely high-speed heterojunction bipolar transistors

Semiconductor Process Technology

Imec demonstrates extremely high-speed heterojunction bipolar transistors

Imec realized a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, a key enabler for future high-volume millimeter-wave low-power circuits to be used in automotive radar applications. lesen...

AVR and ARM microcontrollers for next generation applications

Inside Atmel's micros market

AVR and ARM microcontrollers for next generation applications

Atmel's AVR microcontroller architecture was developed in 1996. AVR was one of the first MCU families to use on-chip flash memory. ELEKTRONIKPRAXIS spoke with AVR founder Alf-Egil Bogen, Chief Marketing Officer at Atmel. lesen...

Look Ma, No Motherboard!

Programmable Logic & Embedded Computing

Look Ma, No Motherboard!

How one design team put a full single-board computer with SATA into a Xilinx FPGA. The joint solution would not have been possible without short turnaround times between two Xilinx Alliance Program Partners. lesen...

Adhesion to Aluminium of PUR Coating for LED encapsulation

Adhesion to Aluminium of PUR Coating for LED encapsulation

Only a protection against "environmental influences" and disturbing electrical currents will allow a broad use of mobile electronic devices and sensors even under extreme conditions. lesen...

Gen2 SerialRapidIO and Low Cost, Low Power FPGAs

Data Communication

Gen2 SerialRapidIO and Low Cost, Low Power FPGAs

As bandwidth requirements for applications such as wireless, wireline and medical/imaging processing continue to grow, designers depend on the toolsets necessary to provide them with the real-time signal processing capabilities that are needed. lesen...

Fast and Efficient Power Management Solutions

Power Supply & Digital Control

Fast and Efficient Power Management Solutions

The large number of devices, the high bill of materials, and the increased board space for developing board power supplies are a thing of the past. A single Platform Manager chip offers the latest power management solution. lesen...

Maxim has acquired SensorDynamics – an interview with Vice President Demetre Kondylis

Analog technique and MEMS sensors

Maxim has acquired SensorDynamics – an interview with Vice President Demetre Kondylis

Mid of July Maxim has acquired the Austrian fabless MEMS firm SensorDynamics. This company has developed proprietary MEMS sensor integrated circuits, RF and LF ASICs as well as low power ICs. The main intention of this acquisition should be the strategic integration of sensors, analog functionality and wireless connectivity for a new generation of intelligent devices. We asked Demetre Kondylis, Maxim’s Vice President Sensor Solutions for a statement. lesen...

Comparing Ethernet and RapidIO

Data Communication

Comparing Ethernet and RapidIO

RapidIO, similar to Ethernet, exchanges packets over a variety of media. Recently, the concept of “lossless Ethernet” has been publicized. Lossless Ethernet is also known as “Data Center Ethernet” (DCE). How far can a comparison between these two technologies go? lesen...

FPGA Design Software Evolution

PLDs & Tools

FPGA Design Software Evolution

FPGAs are being used increasingly in more cost sensitive, power sensitive, high volume applications. To meet the challenges inherent in those applications, designers need an easy to use, flexible design environment for exploring different design implementations to achieve their cost, power and performance targets, particularly as designs become larger. lesen...

Most Popular English Articles

On the way to the final: Soccer stadia in glamorous light

Lighting technology

On the way to the final: Soccer stadia in glamorous light

09.07.14 - The world's gaze falls on Brazil and its brand-new soccer stadia, in which 32 international teams compete over a period of four weeks. lesen...

History of the Dev Kit

Development kits

History of the Dev Kit

24.07.14 - Development kits have shaped the technology-led world we know today. Originally a basis for prototyping products and applications, Development Kits are now being used to produce some of the world’s most innovative new technologies. lesen...

Boosting Power Density using Nano-Ceramic Technology

PCIM 2014 News

Boosting Power Density using Nano-Ceramic Technology

08.04.14 - Conventional power brick designs face one fundamental constraint: heat dissipation. The greatest impediment to increasing the power density of DC-DC power supplies, for example, is the rate of heat flow from MOSFETs to the ambient air. lesen...

Tracing and Visualization of Embedded Linux Systems

Embedded Software Development

Tracing and Visualization of Embedded Linux Systems

03.06.14 - Tracing is an important method to detect program errors in embedded systems. Visualization tools lend support to a better understanding of the tracing results. lesen...

Influence of parasitic components in switching behavior

Super-junction MOSFETs

Influence of parasitic components in switching behavior

11.04.14 - The faster switching of the power MOSFETs enable higher power conversion efficiency. However, parasitic components in the devices and boards are involving switching characteristics more as the switching speed is getting faster. This creates unwanted side effects, like high voltage or current spikes or poor EMI performance. lesen...

TÜV Rheinland certifies IP500 wireless modules worldwide

Internet of Things

TÜV Rheinland certifies IP500 wireless modules worldwide

12.05.14 - TÜV Rheinland has joined the IP500 Alliance as a partner for the worldwide certification of IP500 products. IP500 is the global wireless standard / platform for security and safety applications in the IoT (Internet of Things) landscape. lesen...

Daimler and BMW want to charge electric cars

Electromobility

Daimler and BMW want to charge electric cars "unplugged"

16.07.14 - One of the next steps on the way to perfect electric drive and plug-in hybrid vehicles is wireless charging. Daimler and BMW have now agreed on jointly developing and implementing one common technology. lesen...

Gap filling materials and thermal gels keeping electronic assemblies cool

Thermal management

Gap filling materials and thermal gels keeping electronic assemblies cool

01.04.14 - Achieving effective thermal management in equipment such as consumer electronics, portable devices, automotive modules and power supplies requires engineers to eliminate air gaps between hot components and nearby heat-dissipating surfaces. Understanding how to choose and use materials is important. lesen...

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ELEKTRONIKPRAXIS 14/2014

ELEKTRONIKPRAXIS 14/2014

Wenn Optik und Haptik eines Displays entscheiden

Weitere Themen:

Verbesserte SiCLeistungs- MOSFETs
Theorie versus Prozesstoleranzen
Hardware Monitoring

zum ePaper

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ELEKTRONIKPRAXIS 13/2014

ELEKTRONIKPRAXIS 13/2014

Perfekt aufgestellt für jede Gehäuse-Situation

Weitere Themen:

Das M2M-Protokoll OPC UA
Hohe Abtastrate und Bandbreite
Was AC-Quellen können müssen

zum ePaper

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ELEKTRONIKPRAXIS 12/2014

ELEKTRONIKPRAXIS 12/2014

Was Chefs über Software wissen müssen

Weitere Themen:

Automatisches und interaktives Routeb
Hardware mit SCRUM entwickeln
GbE in der Automatisierung

zum ePaper

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