English Articles

Not All Virtualization Approaches are Suitable for Embedded Systems

Software Virtualization

Not All Virtualization Approaches are Suitable for Embedded Systems

Multi-core processors and virtualization bring major opportunities to system developers to cut costs and improve performance by consolidating multi-platform embedded systems onto a single computer platform running multiple operating systems. However, not all virtualization approaches are satisfactory for all applications. lesen...

Integration to make MEMS leap in performance

Integration to make MEMS leap in performance

Micro Electro-Mechanical Systems (MEMS) have become widely popular sensors for measuring motion, acceleration, inclination, and vibration. MEMS sensors are System-in-Package solutions, delivering high resolution and low power consumption, in an extremely small size. lesen...

Multi-Core Processing for Embedded Systems

Parallel Computing

Multi-Core Processing for Embedded Systems

Despite their diverse origins, two enduring topics that still arouse debate and discussion in the engineering community are those of Dilbert comics and Moore‘s Law. Although a discussion of the latest challenge to meet our friend in the comic strip would no doubt be very interesting, the topic today is multi-core, and has more to do with Gordon Moore than Dogbert, Wally and friends. lesen...

The Moment of Truth

PCB assembly & starting up

The Moment of Truth

An interface-independent core hardware which combines a powerful CPU with dynamically reconfigurable FPGAs and thereby provides high I/O-bandwidth which can be used in an unrestricted way – this idea was to be realised by the CPU-module CERO. lesen...

Metallizing PCB Edges

Revolutionised physical properties of electronic devices

Metallizing PCB Edges

One speciality of the PCB for the application platform “meltemi” is edge plating (or edge metallizing). Edge plating provides clear measurable advantages at comparably ignorable costs for devices with moderate or high demands regarding EMC, signal-integrity and de-heating. Practice has proved that the theory can be implemented and works. lesen...

Most Popular English Articles

Measuring wind turbines from a distance

Fraunhofer IOSB

Measuring wind turbines from a distance

25.02.14 - The rotor and tower of a wind turbine can vibrate even in normal operation. The analysis of these vibrations plays an important role in development and maintenance. The Fraunhofer Institute IOSB uses modern technology to measure the vibration pattern of the system structure from a distance. lesen...

Fast multimedia link testing to speed up implementation

APIX2

Fast multimedia link testing to speed up implementation

11.02.14 - INOVA Semiconductors, inventor of the APIX standard for real-time gigabit links for automotive applications and Alfamation, supplier of hardware and software test products and turn-key test and measurement solutions for automotive infotainment systems, have announced a close cooperation to speed up the integration of APIX2 technology into automotive applications. lesen...

Talking in 3D: Discussing and administrating complex construction models via a web browser

XML3DRepo

Talking in 3D: Discussing and administrating complex construction models via a web browser

20.03.14 - New software XML3DRepo enables constructing engineers to save 3D objects, change them and administer changes automatically via web browser. lesen...

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

Besi and Imec

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

19.01.14 - The nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing. lesen...

Co-Design Antenna for High Precision GNSS

Imec and Septentrio

Co-Design Antenna for High Precision GNSS

25.02.14 - Imec and Septentrio announced that they have collaborated to the design of a multi-frequency GNSS antenna for GPS, GLONASS, BeiDou and GALILEO. lesen...

Gap filling materials and thermal gels keeping electronic assemblies cool

Thermal management

Gap filling materials and thermal gels keeping electronic assemblies cool

01.04.14 - Achieving effective thermal management in equipment such as consumer electronics, portable devices, automotive modules and power supplies requires engineers to eliminate air gaps between hot components and nearby heat-dissipating surfaces. Understanding how to choose and use materials is important. lesen...

LED lamps: less energy, more light with gallium nitride

LED technology

LED lamps: less energy, more light with gallium nitride

12.03.14 - Fraunhofer researchers have been able to screw the light output of the LED to the top. For that purpose they have developed a transistor on the basis of the semiconductor gallium nitride. lesen...

Challenges and opportunities for relays in cross-industry applications

Relay applications note

Challenges and opportunities for relays in cross-industry applications

01.04.14 - The electromechanical relay market can be subdivided into three large areas of application, which sometimes differ clearly in their requirements. lesen...

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Heftarchiv
ELEKTRONIKPRAXIS 08/2014

ELEKTRONIKPRAXIS 08/2014

Qualität steigern durch Re-Use von Testkomponenten

Weitere Themen:

Mobile Elektronik entstören
Fortschritte bei Leistungswandlern
Obsoleszenz richtig managen

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ELEKTRONIKPRAXIS 07/2014

ELEKTRONIKPRAXIS 07/2014

Smart Factory braucht PROFINET-Verkabelung

Weitere Themen:

Schaltschrank für den Extremeinsatz
Einchip-Transceiver für Sensornetze
Hohe Auflösung zu geringen Kosten

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ELEKTRONIKPRAXIS 06/2014

ELEKTRONIKPRAXIS 06/2014

Vorbeugende Instandhaltung durch Vibrationsmessung

Weitere Themen:

Analog-/Digital-Schaltungstipp
Das Derating bei Netzteilen
Positionserfassung für Antriebsregler

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