English Articles

Challenges and opportunities for relays in cross-industry applications

Relay applications note

Challenges and opportunities for relays in cross-industry applications

The electromechanical relay market can be subdivided into three large areas of application, which sometimes differ clearly in their requirements. lesen...

Gap filling materials and thermal gels keeping electronic assemblies cool

Thermal management

Gap filling materials and thermal gels keeping electronic assemblies cool

Achieving effective thermal management in equipment such as consumer electronics, portable devices, automotive modules and power supplies requires engineers to eliminate air gaps between hot components and nearby heat-dissipating surfaces. Understanding how to choose and use materials is important. lesen...

Strong Growth for OEM Module Business

Infrared OEM Modules

Strong Growth for OEM Module Business

Since the highly demanding segment of government and security applications is rapidly growing, Xenics is strengthening its direct sales force for the 'XenicsCores' product line of ShortWave InfraRed and LongWave InfraRed OEM modules. lesen...

Talking in 3D: Discussing and administrating complex construction models via a web browser

XML3DRepo

Talking in 3D: Discussing and administrating complex construction models via a web browser

New software XML3DRepo enables constructing engineers to save 3D objects, change them and administer changes automatically via web browser. lesen...

LED lamps: less energy, more light with gallium nitride

LED technology

LED lamps: less energy, more light with gallium nitride

Fraunhofer researchers have been able to screw the light output of the LED to the top. For that purpose they have developed a transistor on the basis of the semiconductor gallium nitride. lesen...

Service robot is looking closely

Automatica 2014

Service robot is looking closely

Warehouse robots capable of sorting chaotically delivered parts and domestic assistance robots able to distinguish between graspable objects and living areas. At Automatica, Fraunhofer IPA will present technologies for image processing and collision-free manipulation in a dynamic environment. lesen...

Electronics based on a 2-D electron gas

Semiconductors

Electronics based on a 2-D electron gas

A new material could open the door to a new kind of electronics: researchers at the Vienna University of Technology have created a stable two-dimensional electron gas in strontium titanate. lesen...

Measuring wind turbines from a distance

Fraunhofer IOSB

Measuring wind turbines from a distance

The rotor and tower of a wind turbine can vibrate even in normal operation. The analysis of these vibrations plays an important role in development and maintenance. The Fraunhofer Institute IOSB uses modern technology to measure the vibration pattern of the system structure from a distance. lesen...

Co-Design Antenna for High Precision GNSS

Imec and Septentrio

Co-Design Antenna for High Precision GNSS

Imec and Septentrio announced that they have collaborated to the design of a multi-frequency GNSS antenna for GPS, GLONASS, BeiDou and GALILEO. lesen...

Fast multimedia link testing to speed up implementation

APIX2

Fast multimedia link testing to speed up implementation

INOVA Semiconductors, inventor of the APIX standard for real-time gigabit links for automotive applications and Alfamation, supplier of hardware and software test products and turn-key test and measurement solutions for automotive infotainment systems, have announced a close cooperation to speed up the integration of APIX2 technology into automotive applications. lesen...

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

Besi and Imec

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

The nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing. lesen...

The right memory solution for the Internet of Things

Data Communication

The right memory solution for the Internet of Things

At the beginning of the Internet revolution, all IP addresses were assigned to computers of one sort or another. That time has long gone by. As the Internet developed, more kinds of computing devices became connected and a big chunk of the Internet traffic is now generated by "things" that autonomously communicate with each other, rather than by human operated computers. lesen...

Understanding Resolution in optical and magnetic Encoders

Encoder

Understanding Resolution in optical and magnetic Encoders

How the different types of rotary encoders work and what differentiates the performance of the many types available today. lesen...

Consistent workflows for electronics production

SMT Placement

Consistent workflows for electronics production

Modern electronics production does not only require powerful placement platforms but also the continuous support for all workflows on the factory floor. SIPLACE focuses on solutions aiming for this. lesen...

FPGA-based board design at the IN2P3 institute in France

Electronics Design

FPGA-based board design at the IN2P3 institute in France

FPGAs are at the heart of most of the electronics of the Large Hadron Collider's detector systems. The designers were looking for a way to speed up the FPGA-based board development. lesen...

DFX – Product development with an integrated production solution

Design strategies

DFX – Product development with an integrated production solution

Design for excellence – shortly DFX – encompasses methods, design guidelines and checklists for the improvement of products and processes which can lower costs in several phases of the product lifecycle. lesen...

Success is predictable – Quality is the Foundation

Quality assurance

Success is predictable – Quality is the Foundation

The electronics manufacturer dresden elektronik stresses the close cooperation with the customers as a cornerstone of its testing strategy. In many cases the customer determines which testing tools to employ. lesen...

Lean processes in development: risks and costs under control

Strategy

Lean processes in development: risks and costs under control

Unstructured projects, incalculable expenses and long lead times in development are the woes of many electronics manufacturers. The frontloading strategy keeps those problems in check. lesen...

Radio-based checks of process steps increase efficiency

Logistics

Radio-based checks of process steps increase efficiency

Modern identification technologies like RFID can play their part in reducing the error rate and making work processes more efficient. This is especially true for manual procedures in electronics manufacturing. lesen...

LPKF Presents Prototyping for 3-D Molded Interconnect Devices

Laser Direct Structuring

LPKF Presents Prototyping for 3-D Molded Interconnect Devices

The LDS process has something to offer: thanks to laser direct structuring (LDS), traces are produced on three-dimensional plastic bodies. Instant metallization generates the copper strip conductors. lesen...

Most Popular English Articles

Measuring wind turbines from a distance

Fraunhofer IOSB

Measuring wind turbines from a distance

25.02.14 - The rotor and tower of a wind turbine can vibrate even in normal operation. The analysis of these vibrations plays an important role in development and maintenance. The Fraunhofer Institute IOSB uses modern technology to measure the vibration pattern of the system structure from a distance. lesen...

Talking in 3D: Discussing and administrating complex construction models via a web browser

XML3DRepo

Talking in 3D: Discussing and administrating complex construction models via a web browser

20.03.14 - New software XML3DRepo enables constructing engineers to save 3D objects, change them and administer changes automatically via web browser. lesen...

Fast multimedia link testing to speed up implementation

APIX2

Fast multimedia link testing to speed up implementation

11.02.14 - INOVA Semiconductors, inventor of the APIX standard for real-time gigabit links for automotive applications and Alfamation, supplier of hardware and software test products and turn-key test and measurement solutions for automotive infotainment systems, have announced a close cooperation to speed up the integration of APIX2 technology into automotive applications. lesen...

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

Besi and Imec

Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

19.01.14 - The nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing. lesen...

Co-Design Antenna for High Precision GNSS

Imec and Septentrio

Co-Design Antenna for High Precision GNSS

25.02.14 - Imec and Septentrio announced that they have collaborated to the design of a multi-frequency GNSS antenna for GPS, GLONASS, BeiDou and GALILEO. lesen...

Gap filling materials and thermal gels keeping electronic assemblies cool

Thermal management

Gap filling materials and thermal gels keeping electronic assemblies cool

01.04.14 - Achieving effective thermal management in equipment such as consumer electronics, portable devices, automotive modules and power supplies requires engineers to eliminate air gaps between hot components and nearby heat-dissipating surfaces. Understanding how to choose and use materials is important. lesen...

LED lamps: less energy, more light with gallium nitride

LED technology

LED lamps: less energy, more light with gallium nitride

12.03.14 - Fraunhofer researchers have been able to screw the light output of the LED to the top. For that purpose they have developed a transistor on the basis of the semiconductor gallium nitride. lesen...

Challenges and opportunities for relays in cross-industry applications

Relay applications note

Challenges and opportunities for relays in cross-industry applications

01.04.14 - The electromechanical relay market can be subdivided into three large areas of application, which sometimes differ clearly in their requirements. lesen...

Info-Dienste für Elektronik-Professionals

Immer aktuell informiert: der EP Tagesspiegel mit aktuellen Branchen-Nachrichten der letzten 24 Stunden oder die wöchentlichen themenspezifischen Newsletter "Fachwissen für Elektronikprofis"  von elektronikpraxis.de. Jetzt kostenlos abonnieren!

Heftarchiv
ELEKTRONIKPRAXIS 08/2014

ELEKTRONIKPRAXIS 08/2014

Qualität steigern durch Re-Use von Testkomponenten

Weitere Themen:

Mobile Elektronik entstören
Fortschritte bei Leistungswandlern
Obsoleszenz richtig managen

zum ePaper

zum Heftarchiv

ELEKTRONIKPRAXIS 07/2014

ELEKTRONIKPRAXIS 07/2014

Smart Factory braucht PROFINET-Verkabelung

Weitere Themen:

Schaltschrank für den Extremeinsatz
Einchip-Transceiver für Sensornetze
Hohe Auflösung zu geringen Kosten

zum ePaper

zum Heftarchiv

ELEKTRONIKPRAXIS 06/2014

ELEKTRONIKPRAXIS 06/2014

Vorbeugende Instandhaltung durch Vibrationsmessung

Weitere Themen:

Analog-/Digital-Schaltungstipp
Das Derating bei Netzteilen
Positionserfassung für Antriebsregler

zum ePaper

zum Heftarchiv